lead frame

The punching process of the lead frame was analyzed, the multi-position progressive die was designed.

分析了引线框的冲压工艺性, 设计出了 多工位 级进模.

Attraction type LLM dual in line lead frame

吸引型直线悬浮电动机双列直插式引线框架

The heavy gauge lead frame is made of oxygen-free copper.

大尺寸引脚框由无氧铜制成.

The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。

Dual in line lead frame quad flat package

双列直插式引线框架四列直插式扁平外壳

The copper alloy strip of lead frame is the fundamental material for integrate circuit.

引线框架用铜带是集成电路的重要基础材料。

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

COB type LED has the lower thermal resistance than lead frame . Metal substrate appropriate power package.

COB型LED有 较支架低的热阻系数. 是照明用LED最合适之封装结构.

Dual in line lead frame Hard-drawn aluminium wire for overhead line conductors

双列直插式引线框架GB/T17048-1997架空绞线用硬铝线

Numerical analysis of surface flaking in finish rolled lead frame copper alloy

引线框架铜合金精轧薄板表面起皮剥落的数值分析